Abstract
The influence of the silver nanoparticle (AgNP) concentration in solution on the electrodeposition of Zn-Cu/AgNP composite coatings was studied by cyclic voltammetry. The composition and structure of the Zn-Cu/AgNP composite coatings were analyzed using glow discharge spectroscopy (GDS), inductively coupled plasma spectrophotometry (ICP), and X-ray diffraction (XRD). The electrodeposition of Zn-Cu/AgNP composites was studied in an electrolytic bath containing glycine and AgNPs in suspension and was shown to occur through two processes with different energies. The first process (Pc′) occurs in the potential range from −0.4 to −0.7 V vs saturated calomel electrode (SCE) and is mainly associated with the electrodeposition of a copper film, while the second process (PcIV) corresponds to the bulk deposition of Zn-Cu/AgNPs and occurs from −1.4 to −1.6 V vs SCE. The formation of different phases of the Zn-Cu alloys and a change in the elemental composition of the coating as a function of the AgNP concentration in solution were observed from the elemental composition analysis.Antimicrobial tests performed on the Zn-Cu/AgNP composite coatings against the microorganisms Escherichia coli as a model gram-negative bacteria and Staphylococcus aureus as a model gram-positive bacteria revealed 95% to 100% inhibition of bacterial growth after 10 min of contact for the Zn-Cu/AgNP coating with a AgNP content of 0.28 wt%.
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