Abstract
Electrodeposits of Cu-Ni alloys containing up to 90% Ni were obtained from aqueous solutions containing copper(II) sulphate, nickel(II) sulphate and L-asparagine. An increase in current density or pH increased the percentage of nickel whereas increasing the temperature of plating increased the amount of copper in the deposit. An increase in the nickel content of the solution increased the nickel in the deposit. Current efficiencies were generally high. Deposits containing more than 10% Ni and obtained at current densities greater than 2.0 A dm -2 were black and powdery and possessed poor adhesion. Thiourea, saccharin, dextrin, resorcinol, β-naphthol and gelatin did not improve the appearance, texture or adhesion of deposits.
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