Abstract
Copper–matrix–carbon nanotubes (Cu–CNTs) composite films were prepared in a Cu plating solution with multiwall carbon nanotubes (MWCNTs) using electrodeposition. The MWCNTs surface treatment method, electroplating solution system, electroplating conditions, heat treatment process and other parameters of this process are discussed. The results showed that MWCNTs purified by HCl treatment and dispersed by stearyltrimethylammonium bromide are more suitable as add-on materials for the preparation of the copper matrix composite films by electrodeposition. An appropriate heat treatment process was able to improve the structures and properties of the composite films. The final products showed that the MWCNTs were evenly distributed in the composite films and joined with the copper grains to form a mutually entangled mesh structure with excellent corrosion resistance (3.19 × 10−8 Ω M) and a hardness of 53.5 HV. All this was possible through extensive optimization of the electrodeposition and post-treatment parameters.
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