Abstract
Eutectic Sn 3.5 wt % Ag alloy is one of the most promising lead-free solders in wafer bumping for flip-chip interconnection. Its electrodeposition in pyrophosphate-iodide-based baths was investigated. In particular, the effects of polyethylene glycol 600 and formaldehyde as surfactants were studied, and their addition proved to facilitate achieving a near-eutectic composition for the Sn–Ag alloy. Different deposited film morphologies were analyzed using scanning electron microscopy (SEM) and focused ion beam/SEM. X-ray diffraction investigations indicated that a biphasic structure of and was present in the as-electrodeposited film. To further confirm the efficacy of the electrodeposition process, fine pitch Sn–Ag solder bumps with smooth surface and homogeneous composition were achieved on glass test wafers.
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