Abstract
Electrodeposition of copper on mild steel substrate using a non-cyanide alkaline bath containing glycerol as complexing agent has been developed. To improve the quality of the copper deposit, current efficiency and throwing power of the plating electrolytes, the additives imidazole and benzotriazole were employed and their effect on the surface morphology, grain size and hardness were determined. The complexation of copper ions with glycerol was analysed using UV/Visible absorption spectrophotometric techniques. XRD data obtained for electro- deposited copper showed a polycrystalline nature with body centered cubic structure. SEM and AFM analysis of the deposited copper revealed a uniform and smooth surface morphology with grain refinement in the presence of additives.
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