Abstract
The memristive characteristics of Ge2Sb2Te5 (GST) as a representative chalcogenide material have been verified and show great potential for memory applications. This paper focuses on the influence of different electrode materials on the properties of GST-based memristors. Several electrode materials (Ti3W7, Ag, Cu, and Ta) were adopted in devices with a top electrode (TE)/GST/bottom electrode (BE) layer structure. Through different current–voltage (I–V) curves, it was demonstrated that devices with Ag or Cu electrodes are suitable for GST-based memristors, while those utilizing inert electrodes are not. Because of their relatively smaller radius and lower binding energy, it is much easier for Ag and Cu to diffuse into the GST layer and form conductive filaments. The results obtained from memristors annealed at different temperatures further support the conductive filament model. Moreover, an optimized Cu/Ag/GST/Cu device structure different from the traditional TE/GST/BE structure is proposed, showing improved stability with higher Roff/Ron ratio and good endurance.
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