Abstract
Copper was electroplated from cupric sulfate-sulfuric acid solutions with various concentrations of thiourea and chloride ions. The microstructures of deposits were analyzed by optical microscopy, X-ray diffraction (XRD) and transmission electron microscopy (TEM). XRD results indicated that the most preferred orientation of the copper deposits was (220) when thiourea concentrations were greater than 5 ppm. However, the preferred orientation changed obviously when chloride ions were added together with thiourea;, moreover, the grain type of the deposit changed from columnar to equiaxed. TEM images showed considerable twinning in copper plated from solutions containing less than 1 ppm thiourea. Grain sizes of copper deposits decreased when higher concentrations of thiourea were added to the plating bath, together with chloride ions.
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