Abstract
The electrochemistry of Cu(I) oxide was examined in the 66.7–33.3% mole fraction (m/o) urea–choline chloride melt. Electrochemical parameters that were measured include the standard heterogeneous rate constant and transfer coefficient of the Cu(I)/Cu(II) reaction and the Cu(I) diffusion coefficient. Data about the density, equivalent conductance, and absolute viscosity of this melt were obtained over the temperature range of 298–353 K. The conductivity and viscosity exhibited the non-Arrhenius behavior typical of glass-forming liquids. Overall, the physicochemical properties of the urea–choline chloride melt are comparable to those of common room-temperature ionic liquids. The electrodeposition of Cu was examined on glassy carbon and platinum electrodes by using potential-step techniques. The critical number of atoms required for the formation of a stable nucleus on glassy carbon was , indicating that active sites on the electrode surface served as critical nuclei. Cu deposits on Ni substrates were dense, nodular, and compact.
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