Abstract
Initial stages of copper electrodeposition on highly oriented pyrolytic graphite (HOPG) from acid sulphate solutions are studied using cyclic voltammetry and chronoamperometry. The electrolyte consisted of 0·001 mol dm−3 copper sulphate and 1·0 mol dm−3 sulphuric acid containing polyethylene glycol (PEG) and Cl−. It was found that the additives produce an initial inhibition of copper deposition, probably related to the adsorption. The initial deposition kinetics corresponded to a model including progressive nucleation and diffusion controlled growth. Addition of chloride ions and PEG did not change the initial nucleation of copper electrocrystallisation, but increased the nucleation rate and the number density of nuclei on the surface.
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