Electrochemical migration control of silver-paste conductive adhesives

Abstract

Summary form only given. Although conductive adhesives have been studied for many years as a lead-free for electronic interconnect are limited to low voltage display driver devices. This is due to the serious concerns associated with the long-term reliability and high voltage application issues caused by the silver migration, hi this study, a novel approach to reduce silver migration and enhance the long-term reliability of conductive adhesives is discovered by using self-assembled monolayer molecular wires. The novel approach enhances the long-term reliability and durability of conductive adhesives and enables the EGA for high voltage applications. In addition, the self-assembled molecular wires help the dispersion of conductive fillers (in particular, nano-sized (<100 nm) conductive fillers) in the polymer matrix, and enhance the electrical conductivity of conductive adhesives. Due to the high current density of those functional molecular monolayers - the current carrying capability of conductive adhesives can also be improved significantly