Abstract
Galvanostatic measurements, conducted using a novel electrochemical chemical mechanical planaritation tool, revealed surface passivation layers on copper-coated silicon wafers using benzotriazole (BTAH), ammonium salicylate, maleic acid, malonic acid, and 3-methyl-2-oxazolidinone. Measurements conducted in 249.5 g/L hydroxylamine sulfate containing 250 ppm of BTAH at pH 3.5 exhibited bilayer formation with associated measured passivation rates of 0.313/s and 0.00427/s. Similar rates were measured for ammonium salicylate and maleic acid. © 2004 The Electrochemical Society. All rights reserved.
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