Electrochemical investigation of the corrosion properties of three-dimensional nickel electrodes on silicon microchannel plates

Abstract

The corrosion properties of three-dimensional nickel electrodes deposited on silicon microchannel plates by electroless and electrodeposition processes are studied by electrochemical methods. The nickel thin film deposited on the silicon microchannel plate protects the silicon skeleton in the aqueous electrolytes containing alkalis and salts and the electrolyte containing salts may be a good choice due to the low corrosion rate and no damage to silicon. The nickel-coated silicon microchannel plate electrodes exhibit low resistance and high surface defect concentration after the electrodeposition process and p- and n-type semiconductor properties are observed in the alkali and salt media, respectively.