Electrochemical Formation of Laminar Deposits of Controlled Structure and Composition: II . Dual Current Pulse Galvanostatic Technique

Abstract

A dual current pulse technique was developed for plating two layers of different metals, or any number of pairs of layers, from a single bath. The key condition is to maintain the current density from the first current pulse below the diffusion limiting current density of discharge of the more noble metal and that from the second pulse well above the former and below the limiting current density of deposition of the less noble metal. If the content of the first metal in the second layer is to be small, the concentration of its ions in solution must be much smaller than that of the ions of the second metal. Example of plating several layers of copper and nickel upon each other is given.