Abstract
The formation of adsorbed layers of Cu atoms and of thin and thick copper patches was studied at constant potential between 0.6v and 0.lv on smooth platinum in acidic solutions containing between . After an activation procedure copper deposition was allowed for different times up to 1600 sec. The copper layers were characterized by the waves in the current‐potential curves during their anodic stripping by a linear potential sweep at 30 mv/sec. Adsorbed layers alone are produced between 0.6 and 0.4v. Sites for weakly and strongly bonded Cu atoms may be distinguished as for H adsorption. At potentials between 0.4 and O.lv the adsorbed layer is formed first, followed by the formation of thin and thick copper patches. The production of thin patches that do not yet possess the bulk properties of thick patches could be investigated at 0.3v. The extent of the formation of thin patches is small.
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