Electrochemical deposition of nickel from local nickel sulphate solution on copper substrate

Abstract

In this work, nickel was deposited on copper substrate through electrodeposition which was abstracted from local sulphate salt. Nickel deposition on copper substrate was done in both presence of vitamin C and saccharin additive. Boric oxide was used as buffering agent and pH of the solution bath was maintained through sulfuric acid and ammonium hydroxide. Round shape deposition on copper substrate was observed in the presence of vitamin C, while columnar shape particles were observed in the presence of saccharin additive. Deposition of nickel was done through sulfate bath on copper substrate. Boric acid was used as buffering agent and direct current electrolysis were conduct throughout this experimental work. pH of the solution was kept constant with the help of diluted sulfuric acid and ammonium hydroxide. The deposited nickel particles were obtained in round shape in the presence of vitamin additive, while columnar shape particles obtained in saccharin additive. The experimental conditions were optimizing to get smooth, adherent, and acid resistance surface. This research work reported that, rate of sulfate bath deposition increases lineally with increase in temperature and pH of the solution.