Abstract
Cyclic voltammetry, anodic stripping voltammetry (ASV) and coulometry were used in conjunction with electrochemical quartz crystal microgravimetry (EQCM) and ex situ X-ray photoelectron spectroscopy (XPS) for a study of the electrodeposition and stripping of Cu, Ni and CuNi alloy thin films at a polycrystalline Au surface. A deaerated Watts bath was employed for the electrodeposition of Ni and CuNi thin films, the bath containing Cu 2+ ions (Ni:Cu = 200:1 mole ratio) in the latter case. These films showed the most satisfactory stripping in either 0.1 M HCl or 0.1 M H 2SO 4. Coulometry was used in conjunction with EQCM data for mapping the (potentiostatic) plating efficiency as a function of deposition potential in the Cu and Ni systems. For the CuNi alloy, similar data were acquired by additionally utilizing XPS compositional information and assuming current additivity in the (non-interactive) co deposition of Cu and Ni. Finally, the feasibility of employing the combined ASV-EQCM technique for analysis of CuNi/Ni bilayers is presented.
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