Abstract
Electrochemical corrosion tests were performed on various tin-based solder alloys in stirred potassium formate solutions, pH = 8 and 10.5, with or without additives of corrosion inhibitor, between 20 °C and 75 °C. Open circuit and corrosion potentials and corrosion rates were measured, and galvanic corrosion of the tin-silver solder/copper couples was evaluated. The effects of pH and inhibitor on corrosion of tin-based solder alloys were also assessed.
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