Abstract
The electrochemical behaviors, microstructures, and corroded products of lead-free solders were investigated in this study. The 63Sn-37Pb and Sn-3.5Ag solder alloys were also tested for comparison. The Sn-3.5Ag solder alloy had a higher equilibrium potential than the ones of 63Sn-37Pb and Sn-9Zn The Ag addition enhanced the corrosion resistance of the Sn-9Zn solder alloy. Passivation behavior occurred in the solder alloys used in this study except the 63Sn-37Pb one. X-ray diffraction patterns showed that the Zn segregated in the Sn-9Zn solder alloy as solidified, but it dissolved when 0.5 wt % Ag was added to the solder alloy. The and were found in the Sn-9Zn-1.5Ag solder alloy but they were substituted by the when the Ag content in the solder alloy was above 2.5 wt %. However, they were the initial sites for pits formation. The corroded product of was observed in all solder alloys tested. In addition, the ZnO, and SnO were observed in the solder alloys. © 2004 The Electrochemical Society. All rights reserved.
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