Abstract
Voltammetry of microparticles (VMP) is used as a tool to identify Ag/Cu alloys. The identification process is based on the position of the voltammetric peaks obtained in different media: ammonia buffer 0.1 M, oxalic acid 0.4 M and thiocyanate 0.4 M, for samples of Ag, Cu and Ag/Cu alloys, immobilized on a graphite electrode. The phases and structure of four Ag/Cu alloys (91 : 9, 70 : 30, 40 : 60, 10 : 90) were studied by scanning electron microscopy (SEM) and then related to the voltammograms to establish a relationship between structure and peak shape and position.
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