Electrochemical and Passive Behaviors of Pure Copper Fabricated by Accumulative Roll-Bonding (ARB) Process

Abstract

In the present work, electrochemical and passive behaviors of pure copper fabricated by accumulative roll-bonding (ARB) process in 0.01 M borax solution (pH = 9.1) have been studied. Before any electrochemical measurements, evaluation of microstructure was obtained by Vickers microhardness, x-ray diffraction (XRD), and transmission electron microscopy. The results of microhardness tests revealed that microhardness values increased with the increasing number of ARB cycles. Also a sharp increase was seen in microhardness after the first ARB cycle, whereas mediocre additional increases were observed afterward up to the seven cycles. Moreover, XRD patterns showed that the mean crystallite size values decrease with the increasing number of ARB cycles. To investigate the electrochemical and passive behaviors of the samples, the potentiodynamic polarization, Mott-Schottky analysis and electrochemical impedance spectroscopy (EIS) were carried out. Polarization plots revealed that as a result of ARB, the corrosion behavior of the specimens improves compared with the annealed pure copper. Also, the Mott-Schottky analysis and EIS measurements showed that the increasing number of ARB cycles offer better conditions for forming the passive films with higher protection behavior, due to the growth of less-defective films.