Abstract
The formation and reduction of passive layers on copper in weakly alkaline solutions saturated with N2 and O2 were studied. Voltammetric and ellipsometric techniques were employed to examine the structural characteristics of the layers formed in the −0.32 to 0.75 V vs RHE potential region. Optical measurements at open circuit potentials (Eoc) were also made to simulate operational conditions. The passive layer consists of a duplex structure: an outer hydrated copper oxide film and an inner dehydrated film. This inner layer is composed of Cu2O with a surface excess of Cu(ii) ions. The growth rate of the oxide layers at controlled potentials is higher in O2 saturated solution. The corrosion resistance of copper depends on the presence of O2 in the electrolyte, on the stirring rate and on the Eoc value.
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