Abstract
Sputtered molybdenum thin films are widely used in thin film transistor-liquid crystal display (TFT-LCD) industry as a data material. However, little is known about the electrochemical behavior in a wet etchant which is composed of nitric, phosphoric, and acetic acid solutions. In this work, the wet corrosion behavior of RF magnetron sputtered molybdenum thin films in acid solutions was studied by using electrochemical analysis. The effects of deposition parameters such as the RF power and the argon pressure on the corrosion rate were also examined. The dissolution rate strongly depended both on the process parameters and the type of chemical solutions. The Mo thin films dissolved fastest in the nitric acid solution among the various solutions. The remarkable result was that Mo thin films rapidly dissolved in the acetic acid solution. The dissolution rates also increased with increasing RF power and argon pressure. The relationships between the deposition parameters and the corrosion rate are discussed in terms of the thin film microstructure and the susceptibility to corrosion.
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