Electro-thermal coupling analysis methodology for RF circuits

Abstract

In this paper an electro-thermal co-simulation methodology suitable for RF circuits is presented. It circumvents traditional transient simulation drawbacks that arise when signals or magnitudes whose frequencies are separated orders of magnitude are present simultaneously in the simulated circuit. The accuracy of the proposed technique is verified experimentally by comparing simulation and measurements of the thermal coupling between an integrated power amplifier (PA) and a differential temperature sensor embedded in the same silicon die, using a 65nm CMOS technology.