Abstract
Layer-by-layer depositions of nickel and copper with nano-sized thickness were well formed by two-step pulsation at pH 4.5. The multi-layers were composed of a copper-rich nickel phase of 8: 2 with 14-nm thickness and a nickel-rich copper phase of 9: 1 with 16-nm thickness, respectively. The Ni2+-citrate solution controls the optical and chemical properties of the Cu2+Ni2+-citrate solution. The absorbance change with pH was related to complex formation. The relative contents of nickel and copper of an electroplated layer depended on electroplating conditions like the current density and pH. The electromagnetic shielding efficiency of the copper-nickel composite mesh/PI film showed more effective electromagnetic interference (EMI) shielding properties than a pure copper mesh/PI film in the GHz frequency range.
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