Abstract
A method is presented to self-repair cracks in embedded silver grid structures used in large area organic electronics. The repair procedure is based on electro-deposition, incited by the application of a moderate DC voltage across the crack. During this process the organic anode that is in direct electrical contact with the silver grid, functions as an appropriate medium for ion migration. Restoration of conductivity is achieved by the formation of dendritic metal structures that connect the cathodic to the anodic side of the crack. The metal dendrites decrease the gap resistance by one order of magnitude. Subsequently, another three orders of magnitude are gained upon sintering the dendrites using a high voltage pulse, yielding restored conductance levels nearly within one order of magnitude difference from native track conductance.
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