Electrically induced spreading of EGaIn on Cu substrate in an alkali solution under wetting and non-wetting conditions

Abstract

Electrically actuated movement of liquid metals is quite promising in mechanical engineering and applied physics. However, little work has so far been performed on the effect of current polarity on the actuation of the eutectic gallium–indium (EGaIn) alloy moving on metal substrates. In this work, the spreading of EGaIn on copper (Cu) substrate under different direct-current (DC) polarities in the 0.5 mol/L NaOH solution was investigated, and the underlying mechanisms were addressed. When the Cu substrate was connected to cathode, the wetting was essentially attributed to the reduction in the oxidized surface of the Cu substrate; whereas, under the opposite polarity, the spreading was related to the tension gradient along the EGaIn–solution interface, which induced Marangoni flow, despite the fact that the EGaIn–Cu system was non-wetting in this case.