Abstract
Copper sulfide (CuS) powder precipitated from a chemical bath containing Cu(II) chloride and thiourea and annealed in air at 150 °C for 1 h was dispersed in a poly(acrylic acid) aqueous solution (with additional water or propylene glycol as a dispersive agent) and cast on glass slides. Upon evaporation of the solvent, coatings of ∼50 μm in thickness of a CuS-poly(acrylic acid) composite are formed. Measurement of sheet resistance (R□) indicates a percolation threshold of electrical conduction at a weight fraction [wf is wt. % of CuS to poly(acrylic acid) + CuS] of about 40%; the composite undergoes a transition from insulator (R□ ∼ 1013 Ω) to conductive state (R□ ∼ 102 Ω). The morphology and thermal stability of the composite depend on the choice of the dispersive agent for the CuS powder; smoother and thermally stable (up to a temperature of 250 °C) coatings are obtained when propylene glycol is used. The results on x-ray diffraction, thermogravimetric analysis, and Fourier transform infrared spectroscopy studies are given to indicate the structure and bonding mechanisms and their dependence on temperature and dispersive agents.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
