Abstract
Nanocomposites made up of polymer matrices and carbon nanotubes are a class of advanced materials with great application potential in electronics packaging. Nanocomposites with carbon nanotubes as fillers have been designed with the aim of exploiting the high thermal, electrical and mechanical properties characteristic of carbon nanotubes. Heat dissipation in electronic devices requires interface materials with high thermal conductivity. Here, current developments and challenges in the application of nanotubes as fillers in polymer matrices are explored. The blending together of nanotubes and polymers result in what are known as nanocomposites. Among the most pressing current issues related to nanocomposite fabrication are (i) dispersion of carbon nanotubes in the polymer host, (ii) carbon nanotube-polymer interaction and the nature of the interface, and (iii) alignment of carbon nanotubes in a polymer matrix. These issues are believed to be directly related to the electrical and thermal performance of nanocomposites. The recent progress in the fabrication of nanocomposites with carbon nanotubes as fillers and their potential application in electronics packaging as thermal interface materials is also reported.
Highlights
Heat dissipation in modern devices continues to be a challenge in the electronics industry as a result of continuous development of smaller, faster packages of integrated circuits
There has been significant growth in nanocomposites research since the first incorporation of carbon nanotubes in a polymer matrix by Ajayan and colleagues in 1994 in which carbon nanotubes were incorporated into an epoxy [6]
In line with the important synthesis-propertiesapplication relationship it is essential to review the history and properties of carbon nanotubes in order to have an appreciation of the driving force behind the growth of nanocomposite related research
Summary
Heat dissipation in modern devices continues to be a challenge in the electronics industry as a result of continuous development of smaller, faster packages of integrated circuits. The history and properties of carbon nanotubes are reviewed in order to shed some light into their potential as polymer fillers, and the subsequent design and fabrication of nanocomposites for electrical and thermal transport applications is discussed
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