Abstract
The temperature dependent electrical transport properties of n-ZnO/AlN/p-Si heterojunction diode fabricated by RF sputtering system have been investigated over a wide temperature range of 303 K–413 K. The AlN buffer layer in-between ZnO and Si lowers the mismatch in thermal expansion coefficient/lattice constant for improved electrical and structural characteristics. XRD pattern and FESEM confirm the crystalline nature and good quality of ZnO thin film with uniform grain size and crack free structure respectively. As measured from the temperature dependent I–V curve, the apparent barrier height reduces as Ideality factor rises which shows good thermal stability within the temperature range studied here. The mean value of barrier height as well as the Richardson constant have been evaluated. Additionally, by taking into account the Gaussian distribution of inhomogeneous barrier heights, the modified Richardson constant has been estimated.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
