Abstract
The two previous chapters have discussed the defects or anomalies that appear in counterfeit components and the physical tests that can be used to detect a subset of these defects. Also highlighted were the limitations of physical tests including their high test time and cost, destructive nature, and limitation to certain defects and certain counterfeit types. Tests such as material analysis and scanning electron or acoustic microscopy require extensive sample preparations, during the course of which the component under test becomes ineligible for further use. Added to the destructive nature, most physical tests are extremely time-consuming and above all, they cannot be used to test the functionality of an IC. Since it is desirable to be able to test as many components as possible, if not all, quick and efficient test methods are required to ensure that ICs pass stringent acceptance tests and that they meet functionality, quality, authenticity and reliability requirements.
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