Electrical signal interference minimization using appropriate core material for 3D integrate circuit at high frequency applications

Abstract

As demand for smaller, quicker, and more powerful devices rises, Moore's law is strictly followed. The industry has worked hard to make little devices that boost productivity. The goal is to optimize device density. Scientists are reducing connection delays to improve circuit performance. This helped them understand three-dimensional integrated circuit (3D IC) concepts, which stack active devices and create vertical connections to diminish latency and lower interconnects. Electrical involvement is a big worry with 3D integrates circuits. Researchers have developed and tested through silicon via (TSV) and substrates to decrease electrical wave involvement. This study illustrates a novel noise coupling reduction method using several electrical involvement models. A 22% drop in electrical involvement from wave-carrying to victim TSVs introduces this new paradigm and improves system performance even at higher THz frequencies.