Abstract
In this study, we demonstrated that the deposition of Sn on Ni–Fe wires using low-pressure chemical vapor deposition (LPCVD) can be used to control the electrical resistivity of the wires. Furthermore, the effect of the deposition temperature on the resistivity of the Ni–Fe wires was investigated. The resistivity of the Sn-deposited Ni–Fe wires was found to increase monotonically with the deposition temperature from 550 to 850 °C. Structural and morphological analyses revealed that electron scattering by Ni3Sn2 and Fe3Sn particulates, which were the reaction products of LPCVD of Sn on the surface of the Ni–Fe wires, was the cause of the resistivity increase. These coalesced particulates displayed irregular shapes with an increase in the deposition temperature, and their size increased with the deposition temperature. Owing to these particulate characteristics, the Sn content increased with the deposition temperature. Furthermore, the temperature dependency of the Sn content followed a pattern very similar to that of the resistivity, indicating that the atomic content of Sn directly affected the resistivity of the Ni–Fe wires.
Highlights
Rechargeable mobile devices with high-frequency circuits are becoming increasingly popular, owing to rapid developments in the field of microelectronics
Sn was deposited on Ni–Fe wires through low-pressure chemical vapor deposition (LPCVD) to modulate the electrical resistivity of the wires
Sn was deposited at temperatures from 550 to 850 ◦ C, and the Sn-deposited Ni–Fe wires were subjected to structural, morphological, and compositional analyses
Summary
Rechargeable mobile devices with high-frequency circuits are becoming increasingly popular, owing to rapid developments in the field of microelectronics. A current-limiting resistor that provides both over-current and over-temperature protection is one of the components of a high-frequency circuit that are critical for the safe operation of the circuit. Fusing resistors ( called wire-wound resistors), which are made of alloy wires with high melting points, are known to be suitable for use as current-limiting resistors for providing over-current and over-temperature protection [1,2,3]. Ni–Fe alloys are appropriate for fabricating good fusing resistors, owing to their high melting point (1300 ◦ C) and low temperature coefficient of resistance (~10−3 /◦ C). For fusing resistors used in charger circuits, achieving control over the electrical resistivity of the alloy wires, regardless of the inherent material properties, is essential, since the resistivity required varies with the charger circuit.
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