Abstract
The aging effect of the electlical resistance of nickel, copper, and Ni-Cu films and resistance-strain characteristics (strain coefficient or gauge-factor K) are measured in a vacuum bell jar. These effects depend on the thickness of films. The gauge-factor K of relatively thick films tends to approach the value of the bulk one, and the resistance of films decreases with time just after the evaporation. The K-factot of a relatively thin film is larger than that of the bulk, and its resistance increases with time after the evaporation. The gauge-factor K of the films of intermediate thickness has a minimum value and the resistance varies gradually with time.The imperfections of the films produced by evaporation or adsorption of gases are seemed to affect on the electrical and mechanical properties of the films.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
