Abstract
A sandwich structure of Ni/Nb/4H-SiC was prepared and annealed at different temperature from 750°C to 1050°C. The electrical property and crystalline structure of Ni/Nb electrode was characterized by transmission line method and X-ray diffraction. It was found that the annealing temperature and the thickness of Ni/Nb layer played an important role in obtaining Ohmic contact. A low specific contact resistance of 1.1×10-5 Ω·cm2 was obtained when the Ni(50nm)/Nb(50nm) electrode was annealed at 1050°C. The Ohmic contact mechanism of Ni/Nb/4H-SiC was proposed.
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