Abstract
The effect of stress on a Schottky barrier height at a metal-semiconductor interface is investigated for metal-p-type GaP contacts. The diodes are fabricated by evaporating metals (Ag, Au) on polar (111)Ga and (1̄1̄1̄)P surfaces. Stress is applied to the diodes by bending the crystal wafers attached to the cantilever. The variation of the barrier height with stress is determined from the measurements of the current-voltage characteristics under stress. The barrier height decreases under compressive stress parallel to the interface and increases under tensile stress. The change in barrier height on the (111)Ga surface is greater than that on the (1̄1̄1̄)P surface. These experimental results are discussed from the point of both the piezoelectricity and the change in band gap caused by stress.
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