Abstract
Microwave plasma oxidation (below 200 °C) of strained Si on relaxed Si1−xGex buffer layers in N2O ambient is reported. The electrical properties of grown oxide have been characterized using a metal-oxide-semiconductor structure. Fixed oxide charge density and mid-gap interface state density are found to be 6×1010 cm−2 and 1.2×1011 cm−2 eV−1, respectively. The oxide on strained-Si samples has exhibited hole trapping behavior and moderately low interface state generation on constant current stressing.
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