Electrical properties of NbN/NbN x /NbN Josephson junctions

Abstract

In this work, we report the electrical properties of NbN internally shunted Josephson junctions with NbN x barriers. Cross-sectional scanning transmission electron microscopy analysis shows that all layers have the same cubic structure; NbN/NbN x /NbN trilayers were epitaxially grown on MgO substrates. The resistivity of the NbN x films could be varied in the range of 1–104 mΩ cm by controlling both the N2 partial pressure and the deposition time during reactive sputtering. The temperature dependence of the critical current density (J c) and characteristic voltage (I c R n) of the junctions with different barrier resistivities were measured for various barrier thicknesses. For the 10 nm-thick NbN x layer with resistivities of 73.44, 385.72, and 711 mΩ cm, the coherence length of the barrier was determined to be 5.55 ± 0.07, 4.88 ± 0.06, and 1.40 ± 0.13 nm, respectively, corresponding to carrier diffusion rates of 2.741 ± 0.004, 1.211 ± 0.002, and 0.008 ± 0.001 cm2 s−1, respectively. Thus, the reduction in barrier resistivity leads to a larger coherence length and a faster diffusion rate, which will further increase the J c and I c R n of the junction. By adjusting the barrier resistivity and thickness, the J c of the junction can be easily tuned over more than four orders of magnitude, and an I c R n value of 0.97 ± 0.07 mV was obtained at 10 K. The results indicate that the all-NbN self-shunt junction is a promising candidate in high-speed and high-temperature applications.