Abstract
This study evaluated the electrical properties and interfacial reaction of the ball grid array (BGA) packages with various underfills under thermal shock and isothermal aging conditions. The BGA packages were composed of two surface finishing materials on the bottom substrate, viz. bare Cu and electroless nickel-immersion gold (ENIG). The thickness of the intermetallic compounds (IMCs) formed at the interface between the solder and substrate increased with increasing number of thermal shock cycles and isothermal aging times. Also, the growth rate of the IMCs during the isothermal aging condition was faster than that during the thermal shock condition. The electrical resistance of the BGA package with the underfill was lower than that of the BGA package without the underfill under thermal shock condition. The electrical resistance of the underfill with silica particles was lower than that of the underfill without silica particles.
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