Abstract
AbstractA general methodology for modeling packages using the three‐dimensional (3D) TLM method is presented. S parameters are calculated from reflected and transmitted signals, and electrical parameters of equivalent networks are extracted. Frequency domain results (up to 30 GHz) are presented for a microstrip right‐angle bend, a cross junction, and vias. The purpose of this article is to demonstrate the possibilities of using the 3D TLM method for electrical modeling in packaging applications.
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