Abstract

In this evaluation, aluminum oxide layers with thicknesses in the range of 300 nm to 4000 nm are investigated for their electrical insulation capability by measuring the resistance between the substrate and a subsequent conductive layer. The deposition was carried out in a non-reactive RF magnetron sputtering process and in a reactive HiPIMS process, respectively. The substrate materials tested are steel 1.3505 (100Cr6), titanium alloy 3.7164 (Ti6Al4V) and aluminum alloy 3.1645 (AlCuMgPb) with both turned and polished surfaces.Besides resistance measurements, the layers were investigated by SEM and characterized by EDX. During the HiPIMS deposition, the value of the electrical current over the time of one pulse was measured additionally.The comparison of the resistance values showed strong dependencies between the electrical insulation and the substrate materials used, as well as their surface microstructure. Moreover, a deviating insulation performance for the layers deposited by HiPIMS was identified. From the results, a correlation of substrate material, surface microstructure and the corresponding deposition technology is deduced.

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