Electrical conductivity upon sintering of pure Cu produced by material extrusion additive manufacturing: Effects of pore, grain size, and impurity

Abstract

This study investigates the development of pores and microstructures at each processing step and sintering conditions in the material extrusion additive manufacturing process, examining their correlation with related physical properties. This is achieved by fabricating copper parts using material extrusion (MEX) and examining the primary factors that impact the electrical characteristics of the MEX parts. Initially, the application of solvent debinding to MEX-produced Cu parts effectively removes a portion of the binder, forming printing-pattern–induced pores and ineffectual pore channels. Subsequently, thermal debinding eliminates the remaining binder and promotes neck formation between the Cu particles. The process proceeds to a subsequent sintering step, where even after the final sintering, some pores remain. These pores are categorized as sintering-induced and printing-pattern–induced pores. The relatively large pore size due to the printing pattern is identified as the main reason for reduced density of MEX parts, especially those influenced by the contour pattern. As the sintering progresses, the grain size increases, with the overall grain size and shape becoming uniform during extended sintering periods. Impurities, specifically carbon and oxygen, are detected in the sintered part, and their concentrations rise with longer sintering times. After examining the variation in porosity, grain size, and impurity content with respect to sintering time, it becomes evident that porosity plays a pivotal role in influencing electrical conductivity. Consequently, the densest 48 h sintered sample, with a relative density of 95.5 %, achieves the highest electrical conductivity at 94.6 % IACS. This demonstrates that MEX can be effectively employed to craft complex-shaped Cu parts with outstanding electrical properties. In summary, densification is crucial for enhancing the electrical properties of Cu parts produced through MEX, achieved by minimizing printing-pattern–induced pores, the primary contributor to density reduction. This study is poised to advance the manufacturing of high-performance, intricate Cu components by providing insights into the development and locations of primary pores through detailed microstructural investigations.