Abstract

In avionic area, the trend is to a growing use of power electronics systems. In this context, we present results concerning test vehicles (power modules) in order to improve a device assembly technology dedicated to be located the engine, in harsh operating conditions with thermal cycling from -50degC to 200degC in the worst case. The paper focuses on failure modes observed under high operating temperature and high temperature cycles, especially ceramic cracks, conchoidal fracture under the copper lead-frame and solder crack initiation. Numerical thermo-mechanical simulations of the assembly allow to understand the origin of the failures and to improve the assembly lifetime under such severe operating conditions. The objectives of the study are to assess the lifetime behaviour of these modules towards both high temperature and thermal cycling effects

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.