Abstract
Dual beam FIB (focused ion beam)/SEM (scanning elelctron microscope) systems are commonly used for imaging, selective etch and deposition of materials like platinum. The paper presents the results of electrical characterization of platinum thin films deposited by focused ion beam. For measurements, two types of test structures were fabricated: (i) 150x150 :m and 20x20 :m squares with thickness of 5, 10, 30 and 100 nm, and (ii) 30 :m long resistors with variable cross - section (50 nm x 50nm to 1:m x 1:m). The Pt film resistivity has been measured by a four points probe method, to give the value of ~10 x 10-4 A.cm.
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