Abstract
Isotropic conductive adhesive (ICA) is a strong candidate for replacing toxic lead-based solders. Before wide application of this new technology can occur, the degradation mechanisms must be thoroughly understood. In this work, we investigated the electrical characteristics of a commercial ICA under mechanical loading. The results showed that the resistance rose monotonically with the joint strain in the lap shear test, while it increased steadily with the number of cycles in the low-cycle fatigue test. To elucidate the experimental observations, two-dimensional finite-element modeling (FEM) was carried out, and the effects of mechanical loading on the initial intimate interaction among silver fillers were analyzed. Additionally, based on modeling, the possible electrical degradation mechanisms were discussed.
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