Abstract
Dielectrically isolated substrates containing buried highly conducting WSi <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> layers are characterized for the first time using MOS capacitors. The active silicon layer is approximately 3 μm thick with a buried WSi <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> layer adjacent to the isolation layer. The buried metal forms the back contact of the capacitor and excellent MOS characteristics are observed. Minority carrier lifetimes in excess of 200 μs were measured indicating the suitability of these substrates for use in device manufacture.
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