Abstract
In this paper, the deep levels existing in fully implanted and rapid thermal annealed p+n junctions obtained by Mg/Si or Mg/P/Si implantations on nominally undoped n-type InP substrates were detected and characterized by the correlation of two electrical techniques: deep level transient spectroscopy (DLTS) and capacitance–voltage transient technique (CVTT). Two ion implantation-induced deep levels (at 0.25 and 0.27 eV below the conduction band) were detected by DLTS. Several characteristics of these traps were derived from CVTT measurements, paying special attention to their physical nature.
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