Electrical and thermal properties of bio-inspired laminated Cu/Ti3SiC2/C composites reinforced by graphene nanoplatelets

Abstract

Taking inspiration from the unique hierarchical structure of bio-materials like pearl oyster, this study employs bio-inspired composites technological route using flake powder metallurgy to prepare laminated Cu/Ti3SiC2/C composites. The prepared composites have clear laminated structure, uniform dispersion of reinforcing phase and clean interface. At a Cu-plated GNPs content of 0.5 wt%, the composites displayed tensile strength of 300.65 MPa, compressive strength of 575.32 MPa, electrical conductivity of 26.31 MS/m, and thermal conductivity of 285.87 W·m−1·K−1. The reinforcement of composites is caused by the load transfer effect of the laminated structure. During the loading process, the laminated structure creates multiple paths for deflecting cracks, which leads to the redistribution of the applied load. Moreover, the homogeneous distribution of GNPs throughout the laminated structure extends the mean free path of both free electrons and phonons within the material, consequently bolstering the electrical and thermal conductivity of the composites.