Abstract
ABSTRACTThe deposition rate of titanium films plays a determining role for possible fabrication schemes of metallic SET structures. Depending on this rate the resistivities display a striking difference in their temperature dependence which is attributed to their different crystal structure as analyzed by transmission electron-beam microscopy. In addition a sharp rise in resistivity occurs below a critical thickness in films deposited at slow rates. This sharp increase can be used in combination with a step induced thinning to form tunnel junctions for single electron transistor structures.
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