Electrical and mechanical properties of carbon nanotube reinforced copper nanocomposites fabricated by electroless deposition process

Abstract

Multiwalled carbon nanotube/copper (CNT/Cu) nanocomposite powders with different CNTs volume fractions were prepared by electroless Cu deposition on the CNTs. The CNTs underwent acid treatment, sensitization and electroless copper deposition on their surface respectively. The microstructure of the prepared CNT/Cu nanocomposites was investigated by SEM and HRTEM as well as by XRD analysis. Copper was deposited in a form of a layer on the CNTs surface. The CNT/Cu nanocomposite powders were sintered by spark plasma sintering. The microstructure of the sintered materials were investigated by SEM indicating that the CNTs were homogenous distributed in the copper matrix with good sinterability and porosity content lower than unity in case of 5 and 10 vol.% of CNT/Cu nanocomposites and 2.9 and 3.5% respectively for 15 and 20 vol.% CNT/Cu nanocomposites. The electrical conductivity, hardness and the tensile properties were measured for evaluating the sintered CNT/Cu nanocomposites. The electrical conductivity decreased by increasing CNTs volume fraction in copper matrix, but the hardness was increased by increasing CNTs volume fraction. The Young's modulus was increased and the elongation was decreased by increasing the volume fraction of CNTs in copper matrix. In addition, the yield strength of the sintered materials was increased by increasing CNTs volume fraction except in case of 20 vol.% CNT/Cu composite the material was fractured before yielding.