Abstract
The present article is aimed at an investigation of the propagation of elasto-thermodiffusive (ETN) surface waves in a homogenous isotropic, thermoelastic semiconductor material half-space underlying a viscous or inviscid fluid half-space or layer of finite thickness with varying temperature. The relaxation times of heat and charge carrier fields are also taken into consideration during the study. The secular equation that governs the propagation of elasto-thermodiffusive surface (interfacial) waves in the considered composite structures has been derived in compact form after obtaining the general wave solution of the model. Some particular forms of the general secular equation are also deduced and investigated. Numerical solution of secular equation and other relevant relations is carried out for silicon (Si) semiconductor material under different situations with the help of functional iteration numerical technique along with the irreducible case of Cardano's method. The computer-simulated results in respect of dispersion curves, attenuation coefficient, specific loss factor of energy dissipation and relative frequency shift due to loading are presented graphically to illustrate the analytical development. The results have been determined and compared with relevant publications available in the literature at appropriate stages of this work.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.